Low content and low-temperature cured silver nanoparticles/silver ion composite ink for flexible electronic applications with robust mechanical performance

Abstract

In this study, a novel and cost-effective silver nanoparticles (AgNPs)/silver ion composite ink was prepared and used for printing conductive pattern on flexible substrate. Multi-sized AgNPs and silver organic ions contained in the composite ink acted as the conductive fillers. Relationship between the morphology, elemental composition, heating characteristics, and electrical resistivity of the ink and the printed pattern were intensively investigated. The tape test was carried out to rank the adhesion strength of the printed pattern on the substrate. The mechanical stability of the pattern was measured by a cyclic bending test. Analysis of the results demonstrated that the composition of the neck in neighbouring particles severely affects the inter-particle junction resistance. The AgNPs and silver ions in the composite ink mutually promoted each other to significantly reduce the curing temperature. The printed pattern achieved satisfying electrical resistivity of 6.88*10−5 Ω·cm with silver content of as low as 4.68 wt% in the composite ink.