Abstract
The present study applied Sn–0.7Cu–0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu–Zn solid-solution layer (Zn accumulation layer) existed at the Cu/solder interface. After a 72 h current stress, no detectable amounts of Cu6Sn5 were found. However, a small increase in Ag3Sn was found. Compared with a Sn–0.7Cu photovoltaic module, the increase of the intermetallic compounds thickness in the Sn–0.7Cu–0.2Zn photovoltaic module was much smaller. A retard in the growth of the intermetallic compounds caused the series resistance of the module to slightly increase by 9%. A Zn accumulation layer formed at the module interfaces by adding trace Zn to the Sn–0.7Cu solder, retarding the growth of the intermetallic compounds and thus enhancing the lifetime of the photovoltaic module.
Highlights
In order to achieve the goal of global carbon reduction, countries are actively developing various types of renewable energy
This result confirmed that a Zn accumulation layer existed at the Cu/solder interface, decreasing the diffusion of Cu atoms and retarding the overgrowth of Cu6Sn5 intermetallic compound (IMC)
A trace amount of Zn was added to Sn–0.7Cu to form a ternary Sn–0.7Cu–0.2Zn solder, which was applied to a PV ribbon
Summary
In order to achieve the goal of global carbon reduction, countries are actively developing various types of renewable energy. Our previous report showed that the series resistance of the PV module increased by 52% due to the rapid growth of IMCs and the overconsumption of the Ag electrode after bias for a long time [3]. Adding Ag into a Sn–Cu solder can reduce the consumption of the Ag electrode in the module after reflow.
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