Abstract
We study the propagation properties of surface plasmon polaritons on a Cu surface by means of photoemission electron microscopy. Use of a CMOS process to fabricate the Cu thin film is shown to enable very high propagation distances (up to 65 μm at 750 nm wavelength), provided that the copper native oxide is removed. A critical review of the optical loss mechanisms is undertaken and shed light on the effect of single grain boundaries in increasing the propagation losses of the plasmon. A microscopic interpretation is provided, relying on groove induced electromagnetic hot spots.
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