Abstract
In this work, the synergy effects of the stress generation and temperature rise of slurry on the local corrosion during Cu CMP. We observed that the magnitude of generated stress was proportionate to the formation rate of Cu oxide. When specific additive was added into H2O2 solution, re-crystallization, which occurred to minimize the generated stress on the film, caused the breakdown of Cu oxide. The increase in Cu etch rate was resulted from an increased slurry temperature. Therefore, severe local corrosion, particularly at the recess area, occurred through the breakdown of Cu oxide and the temperature rise of slurry.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
