Lithographic stress control for the self-assembly of polymer MEMS structures

Abstract

We present a novel self-assembly mechanism to produce an assortment of predetermined three-dimensional micromechanical structures in polymer MEMS technology using lithographically defined areas of stress and mechanical reinforcement within a single structural material. This self-assembly technology is based on the tensile stress that arises during the cross-linking of the negative tone, epoxy-based photoresist SU-8. Two different thicknesses of SU-8 are used in a single compliant structure. The first SU-8 layer forms the main structural element and the second SU-8 layer determines the aspects of self-assembly. The second SU-8 layer thickness acts to both to create a stress differential within the structure as well as define the direction in which the induced stress will cause the structure to deform. In this manner, both the magnitude and direction of self-assembled structures can be controlled using a single lithographic step. Although this technique uses a single structural material, the basic concept may be adapted for other processes, with different material choices, for a wide variety of applications.