Abstract
Compound semiconductors are the semiconductors composed of more than two chemical elements. Lithium Tantalate(LiTaO₃) wafer is used for several optical devices, especially surface acoustic wave(SAW) device. Because of the lithography in SAW device process, LiTaO₃ polishing is needed. In this paper, the commercial slurries(NALCO2371^(TM), ILD1300^(TM), ceria slurry) used for chemical mechanical polishing(CMP) were tested, and the most suitable slurry was selected by measuring material removal rate and average centerline roughness(Ra). From these result, it was proven that ILD1300^(TM) was the most suitable slurry for LiTaO₃ wafer CMP due to the chemical reaction between solution in slurry and material.
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