Abstract
The hybrid pixel technology combines silicon sensors with CMOS-processing chips by a 2D micro bump-bonding interconnection technology developed at Paul Scherrer Institute [C. Broennimann, E.F. Eikenberry, B. Henrich, R. Horisberger, G. Huelsen, E. Pohl, B. Schmitt, C. Schulze-Briese, M. Suzuki, T. Tomizaki, H. Toyokawa, A. Wagner. J. Synchrotron Rad. 13 (2005) 120 [1]; T. Rohe, C. Broennimann, F. Glaus, J. Gobrecht, S. Heising, M. Horisberger, R. Horisberger, H.C. Kaestl, J. Lehmann, S. Streuli, Nucl. Instr. and Meth. Phys. Res. A 565 (2006) 303 [2]]. PILATUS hybrid pixel detectors like other instruments [X. Llopart, M. Campell, R. Dinapoli, D. San Segundo, E. Pernigotti. IEEE Trans. Nucl. Sci. 49 (2002) 2279 [3]; N. Boudet, J.-F. Berar, L. Blanquart, P. Breugon, B. Caillot, J.-C. Clemens, I. Koudobine, P. Delpierre, C. Mouget, R. Potheau, I. Valin, Nucl. Instr. and Meth. Phys. Res. A 510 (2003) 41 [4]] are operating in the so-called “single photon counting mode”: Every X-ray quantum is directly converted into an electrical signal and counted by the detector system. Several prototype detectors in various geometries were produced, tested and established at different synchrotron beamlines worldwide. We explain the technology and present some recent highlights from various fields of applications.
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