Abstract
A heat exchanger dedicated to the cooling of a microprocessor has been designed and realized. It consists of a bottom wall in contact with the processor and a cover that has been dug to a depth of 200 μm on one side and 1 mm on the other. Thus, by turning the cover, the hydraulic diameter of the channel can be changed. Both hydraulic and thermal performances of this heat exchanger have been experimentally tested. Three-dimensional numerical simulations were simultaneously carried out and good agreement was obtained. The influence of the distributor and the collector on the distribution of fluid flow and heat fluxes is emphasized. A new concept of micro-heat exchanger is proposed for the cooling of electronics devices for which wall to fluid heat exchange quality and pumping effect are critical. The ability of a liquid heat exchanger involving a dynamic deformation of one of its walls to cool a microprocessor is investigated. Three-dimensional transient numerical simulations of fluid flow and conjugate heat transfer were performed using commercial software. Effect of geometrical and actuation parameters has been explored, demonstrating the ability of such heat exchanger to simultaneously pump the fluid and enhance the heat transfer.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
