Abstract

The corrosion behaviour of the intermetallic compound Ni3(Si,Ti) + 4Al has been investigated using electrochemical methods in various chloride concentration up to 1 M at ambient temperature. In addition, open circuitpotential (OCP) and linear polarization resistance (LPR) are portion of electrochemical method. It was foundthat the addition of chloride concentration up to the chloride concentration of 1 M does not shift OCP towardactive region (negative direction) and dissolve passive film on the surface of compounds. The corrosion resistance of the compound was decreased slightly with increasing chloride concentration at ambient temperature.Furthermore, at ambient temperature, the passive film of the compound still tends to sustain a stable condition,even though their corrosion resistances increase slightly. A further experiment must be carried out to clarify thestability of film for Ni3(Si,Ti) + 4Al in more detail Advanced Science Letters, 2017, Vol. 23, 5759–5761

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