Abstract

Metal-semiconductor compounds are used in large numbers in microelectronics and need to be constantly improved. Platinum-silicon semiconductor contacts are often used in sensors and detectors, especially infrared detectors and cameras. Recent developments enable applications in medical technology, such as implanted pressure sensors in the human body.Currently, platinum coatings on silicon-based semiconductor devices are mostly realized by sputtering techniques or platinum-containing printing pastes with subsequent heat treatment.This paper will discuss recent results from the authors' lab on light-induced platinum electrodeposition. Special focus will be given to the pre-treatment of the substrates for the subsequent platinum deposition under illumination. In a systematic approach, all influencing parameters were identified and the most influential ones (pre-treatment, current density, electrolyte type, additives, etc.) were incorporated into an experimental plan. The challenges include a homogeneous platinum coating with low contact resistance and good adhesion. Last but not least, the characterization of the layers (with SEM, EDX, laser scanning microscope, etc.) will be discussed.

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