Abstract
We propose a patterned leadframe substrate (PLS) configuration for light-emitting diode chip-on-board devices (LED COBs) with regular triangular structures on it. The mechanism of this method is analyzed through ray dynamics, which indicate that the light-propagating regimes are considerably different as the structure inclination angle α changes. For typical encapsulant materials (refractive index=1.41), the optimal α is 22.5°~45°. Then the performance of LED COB devices with PLS configurations are verified through 3-D Monte Carlo ray-tracing simulations as well as experimental measurements. Results show that the light-extraction efficiency is significantly improved. A simulated enhancement of 42% and a measured enhancement of 41.07% are observed. These results are in good consistency with the ray dynamic analysis, confirming our predictions about PLS methods. Furthermore, we find that such an LED COB configuration also provides a way to change the angular distribution of intensity from half-peak side angle 101.84° to 141.80°. The findings of our work represent a new concept for LED COB packaging design of great practicality in building lighting systems.
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