Lift-off process for deep-submicron-size junctions using supercritical [formula omitted

Abstract

Deep-submicron-size ( ∼ 100 -nm-size) junctions are a key element to investigate spin-torque transfer phenomena such as current induced magnetization reversal or the spin-torque diode effect. In the fabrication of submicron-size junctions using an etching method, the lift-off process after the etching process tends to be difficult as the size of junctions shrinks. In this study, we present a new lift-off process using supercritical CO 2 . In this process, the samples were immersed in solvent (mixture of N -Methyl-2-pyrrolidone and isopropanol), and pressurized by CO 2 gas. The CO 2 gas then went into supercritical phase and the solvent was removed by a continuous flow of CO 2 . We obtained considerable yield rate (success ratio in lift-off process) of more than 50% for the samples down to 100-nm-size junctions.