Lifetime prediction of BGA assembles with experimental torsion test and finite element analysis

Abstract

Electronic second level interconnect reliability characterization by Accelerated Thermal-Cycling (ATC) test for long-term mission profile is costly and high time consuming. In order to reduce test duration, the torsion test was applied using some specific test parameters to reproduce the same failure modes found in ATC tests and in the field. To define the torsion test parameters, we carried out a complete design of experiments varying the values of temperature, torsion angle and dwell time. The test results indicate a strong dependence of the number of cycles to failure and the three torsion parameters.