Abstract

Experimental methods were evaluated for the determination of lifetime and diffusion length in silicon intentionally doped with potentially lifetime-degrading impurities found in metallurgical grade silicon, impurities which may be residual in low-cost silicon intended for use in terrestrial flat-plat arrays. Results obtained by these methods were compared for mutual consistency. Lifetime measurements were made using a steady-state photoconductivity method, which was compared with a photoconductivity decay technique. Diffusion length determinations were made using short-circuit current measurements under penetrating illumination. This method was compared with a direct measurement of diffusion length using a scanning electron microscope. Mutual consistency among all experimental methods was verified, but steady-state photoconductivity was found preferable to photoconductivity decay at short lifetimes and in the presence of traps. The effects of a number of impurities on lifetime in bulk material, and on diffusion length in cells fabricated from this material, were determined. Results were compared with those obtained by others on the same material and devices using different techniques. General agreement was found in terms of the hierarchy of impurities which degrade the lifetime.

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