Lens-coupled laser diode module integrated on silicon platform

Abstract

Recent interests in the development of multiservice systems have increased the activities be reduced. However, current commercial-grade manufacturing cannot satisfy these needs. The conventional assembly method results in the labor-intensive in optical access networks, such as fiber to the home (FTTH). For these systems to be viable, the optical module assemble costs and package size must process of finding the optimum optical coupling position. In addition, the number and size of parts cannot be reduced due to the difficulty of manipulating them. As a new approach for a lower cost, compact packaging solution, silicon platform technology is very promising. This paper describe a lens-coupled laser diode module integrated on a silicon platform, where a laser-diode, a GRIN rod lens, and single-mode fiber are hybridly integrated on a silicon platform by passive alignment.