Abstract
Abstract Bismuth telluride alloy thin films were prepared on quartz substrates by co-sputtering method and thermally annealed at 423∼623 K, for 1 h. It is found that the Te/Bi ratio decreases upon thermal annealing, indicating the loss of Te as a result of evaporation. This leads to the transformation of Bi 2 Te 3 thin films from n-type to p-type, and consequently the change of Seebeck coefficient from the negative value to the positive one. In addition, the grain growth occurs during thermal annealing, in particular, at higher temperature, as a result, both the electrical conductivity and the seebeck coefficient are increased.
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