Abstract
Using an experimental set up designed to transfer a sample from an UHV chamber into an electrochemical cell, and conversely, without contact with atmosphere, we have studied the underpotential deposition (electrosorption) of copper on a platinum (110) surface. Thanks to the deposition of a droplet of high purity water on the (110) platinum surface, still in UHV, the level of contamination of the surface after forth and back transfer is quite moderate, as revealed by AES. The LEED pattern after copper electrosorption exhibits the same (2×1) periodicity as the clean platinum (110) face, with some linear disorder. Quantitative AES using calibration by clean platinum and copper single crystals correlates reasonably well with coulommetric measurements of the amount of copper adsorbed.
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