Abstract
Two typical types of substrate materials,i.e.,ceramic substrates without insulating layer and metal substrate with insulating layer were studied for the thermal management of COB package.Their chip-to-substrate thermal resistances were simulated and calculated by finite element method.Temperature distribution in two substrates was obtained by infrared thermography,which confirmed the adopted finite element method is feasible in our experiment.Based on these studies,the thermal management of COB package was optimized by finite element simulation.The results show that the ceramic substrate has a lower chip-to-substrate thermal resistance(only half of that of the metal substrate),which indicate that it is more suitable for the heat dissipation in high-power LED package.
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