Abstract

This article discusses configurations of light-emitting diode (LED) light sources for visual inspection of integrated circuit (IC) packages. A package visual inspection (PVI) system with multiple LED light sources used for inspection of IC packages was designed. The image contrast changes of the sample IC packages are explained using the Torrance-Sparrow (TS) model. A few conclusions on appropriate lighting configurations for inspection of various IC packages are achieved. The TS model can be used to represent the specular lobe component. The contrast between two surfaces with different surface roughness values increases with increasing θ i (incident light angle). Lighting C (θ i = 75°) is recommended for packages with high surface roughness heights and resin materials. Lighting B (θ i = 60°) is recommended for packages with moderate surface roughness heights and metal materials. If the background is white, the use of light sources A (θ i = 15°) and B simultaneously is recommended. Light sources A and C are recommended to be chosen for packages with low surface roughness values and transparent materials. The experimental results with the actual gray-level values of the images are compared to support the conclusions. The PVI system is part of an inspection machine. All images of the sample IC packages reported in this article were obtained from an actual production line. Therefore, the results are close to those of the actual inspection situation in the manufacturing industry.

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