Abstract
We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to <TEX>$200^{\circ}C$</TEX>. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 <TEX>$Kg/mm^2$</TEX> to the <TEX>$150^{\circ}C$</TEX> and 270 <TEX>$W/m{\cdot}K$</TEX> to the <TEX>$200^{\circ}C$</TEX>, respectively. This clad metal lead frame material at a high temperature of <TEX>$150^{\circ}C$</TEX> shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.
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