Abstract
Inductive coupling of lead structures in thin film magnetic recording heads causes crosstalk noise in multi-track or read-after-write systems. We analyze various lead structures for multi-element thin film head devices by computing mutual inductance. We find that a lead structure in which one thin film lead is placed on top of the other has superior performance with mutual coupling several orders of magnitude less for the modeled geometries.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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