Layer-Thickness Dependence of Hardness and Local Bucking Behavior in Electrodeposited Ni-Co-Cu/Cu Multilayered Films

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The effect of layer thickness on hardness and buckling behavior was investigated on Ni-Co-Cu/Cu multilayered films. The Ni-Co-Cu/Cu multilayered films were grown on annealed copper substrates by electrodeposition. We fabricated the multilayered films with various layer thicknesses ranging from 10 nm to 1000 nm. First, dependence of Vickers hardness on the Cu layer thickness was investigated. When the Ni-Co-Cu layer had the constant thickness of 75 nm and the Cu layer thickness was smaller than 75 nm, the hardness increased rapidly with decreasing Cu layer thickness. Subsequently, compressive tests were conducted on the multilayered films having the component layers ranging from100 nm to 1000 nm, where the hardness values did not change rapidly with layer thickness. The copper substrates coated with the multilayered films were compressed until 20% strain. From SEM surface observations after the compressive tests, formations of band-like structures having a certain thickness were recognized. Cross-sectional observation revealed that some band-like structures were formed as a result of local buckling of the multilayered film. The vertical thickness of the bank-like structures increased linearly with increasing component layer thickness.