Abstract

Electromagnetic pollution often interferes with nearby electronic equipment and poses a serious threat to the health of people. There is an urgent need to develop soft and lightweight electromagnetic interference (EMI) shielding materials. In this study, a layer-by-layer self-assembly strategy was used implemented to prepare PAN@Ag@PDA@PPy (PAP@PPy) films with unique core-shell and sandwich composite microstructures for electromagnetic interference (EMI) shielding. Results showed that the conductivity of the composite films was the highest at 898.72 S/m after in situ polymerization of pyrrole at low temperatures. The mechanical properties of the conductive films also increased from the initial 16.81 MPa to 22.54 MPa. The average shielding effectiveness (SE) and SSE/t of the composite films with two layers reached as high as 23.81 dB and 6764.20 dB cm2 g−1, respectively. This performance was caused originates from by the layer structure of the PAN film and multiple internal reflections from the interconnected core-shells and sandwich microstructures in of the PAP@PPy films. Therefore, this work study gave provides a new novel strategy for fabricating conductive polymer composites (CPCs) with high-performance EMI shielding.

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