Abstract
Abstract With the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailorable coefficient of thermal expansion as well as low density in many fields. This study reviewed the manufacturing process of SiCp/Al composites in recent years. In addition, the interface between particle and matrix, the application, and the development trend of SiCp/Al composites has also been summarized.
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