Abstract

Establishing electrical interconnects in implantable electronic medical devices frequently requires joining of dissimilar materials. A weld between a tantalum wire and titanium sheet metal on a contact module is presented as an example for dissimilar joining. Latent, brittle cracking was observed in the proximity of the weld upon pull testing. The weld cracking occurs by the mechanism known as hydrogen stress cracking (HSC) and is due to titanium hydride formation. Diffusion facilitated hydrogen transport into the weld area. Diffusing hydrogen accumulates preferably in regions of high stress, causing latent titanium hydride formation and embrittlement of the weld. A broad array of analytical tools such as scanning electron microscopy (SEM), transmission electron microscopy, electron backscattered diffraction, dynamic secondary ion mass spectroscopy, and nanoindentation were utilized to identify the root cause for HSC.

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