Abstract
The inherent parasitic bipolar transistors and p-n-p-n paths in monolithic CMOS circuits can be undesirably triggered into the low resistance and high current state, i.e., latchup. To ensure the safe operation for the future scaled CMOS circuits, an accurate latchup model is required for design optimization. A modified lumped resistance model has been developed which is shown to accurately predict the latchup characteristics provided the device parameters are accurately measured and reflect those at the latchup state. The model includes the spreading resistance effect in the substrate by a resistor network and it is shown to be critical in the latch-up characterization. Experimental data that supports this model is presented. The reversed layouts in CMOS circuits have been shown to greatly improve the latchup holding current. The dynamic characterization of latchup, caused by voltage overshoot at the input terminals, has also been characterized. It is shown that a minimum turn-on time for the latchup triggering exists and is governed by the base transit time in the lateral transistor with an enhanced diffusion coefficient from the high injection effect.
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