Abstract
The technology of laser-induced selective metallization, or known as laser direct structuring (LDS), on a ceramic substrate was evaluated for the fabrication of antenna circuits. A sieving pattern was scanned by the near IR laser on the ceramic substrate, and electroless copper plating was carried out. Appropriate laser activation conditions were chosen to engrave a contrast pattern on ceramic sheet samples. A chosen condition was used to fabricate a line width evaluation pattern, and the results indicated that the feasible fine width could be as fine as 80 μm. This value was used as the design limit of the antenna circuits. The designed antenna circuit patterns were fabricated on the ceramic substrate, and the simulation and direct measurement of the antenna circuit were carried out. This evaluation indicates that the application of LDS technology on the ceramic substrate for the antenna circuits would be feasible.
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