Abstract
Laser direct-write (LDW) techniques based on laser-induced forward transfer (LIFT) of functional materials offer unique advantages and capabilities for the rapid prototyping of electronic, optical and sensor elements as opposed to other digital printing processes like inkjet. LIFT processes have been applied to the fabrication of a wide variety of microelectronic elements such as interconnects, passive components, antennas, sensors, power sources and embedded circuits. Overall, LDW techniques are highly adaptable digital microfabrication processes in terms of materials versatility, substrate compatibility and range of writing speed, scale and resolution. This article will describe the unique advantages and capabilities of LIFT-based processes when used in conjunction with fluids and nanopastes, discuss their applications and consider their future for printing electronics.
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