Abstract
Laser-assisted waterjet micro-machining can significantly reduce the thermal damages to the workpiece as compared to the traditional laser machining process, and hence can overcome the problems associated with laser machining, such as the formation of heat-affected zone, which is a serious issue for thermal sensitive and functional materials. An experimental study on micro-grooving of monocrystalline silicon wafers is reported in this study to explore the effects of process parameters on the groove depth and width as well as the heat-affected zone (HAZ) width. Predictive models based on dimensionl analysis are then developed for estiamting the groove characteristics.
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