Laser transmission joining in microtechnology

Abstract

The laser is a joining tool which is particularly suitable for the application in microtechnology. The process variant laser transmission joining can be used both for welding thermoplastics and bonding of silicon and glass. The investigations presented in this paper cover detailed examinations of both processes. Concerning laser transmission welding of plastics it is examined how far the content of carbon black in the material influences the formation of the weld seam. It is shown that the optical depth of penetration, the weld seam width as well as the formation of the weld morphology differ with varying content of carbon black. Selective laser radiation bonding (SLB) is a novel method for joining silicon and glass based on the transmission heating of the interface of both joining partners and the thermo-chemical principles of silicon direct bonding. SLB shows advantages in reference to the thermal load of sensitive components like sensors and to the selectivity of the joining geometry. In this study the principle method of SLB and the latest advances like the integration of the thermal process control in the laser processing head will be presented. Also experimental test results of the process with constant laser power and thermal process control and the comparison of them will be shown.