Abstract
In this paper, we describe a method that we have developed for studying the behavior of a novel slurry injection system (SIS) during polishing. The method uses sensitive laser measurements and automated image analysis to infer the pitch of the injector body as a function of time under various conditions on a research polisher. The measurements clearly show the pitch response of the injector during typical CMP processing steps, such as pad rinsing and wafer polishing. Changes in pitch behavior as a function of injector design and operation, in combination with removal rate measurements, suggest explanations for the removal rate behavior of the device.
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