Laser programmable metallic vias

Abstract

Solid metallic connections have been successfully formed between two standard levels of metallization using a focused IR laser system. This process of laser via formation has successfully made connections with resistances of <0.8 /spl Omega/. Commercial laser repair systems used extensively by the memory industry were employed to perform over 100,000 individual links over a wide set of laser parameters without failure. This technology provides the yield and reliability necessary for fabrication of rapid turnaround MCM-D, wafer scale integration (WSI), and system-on-a-chip applications. Furthermore, because it is an additive process and the passivation remains completely intact, it lends itself to redundancy for programming high current power and ground lines.