Abstract
Laser processing can achieve high transverse precision but control of the axial penetration depth in percussion drilling and keyhole welding has proved problematic. Processing can be highly stochastic (due to plasma, gas and melt flow dynamics). Normal imaging techniques can provide only minimal depth information and may be blinded by intense backscatter, black body and plasma emission. Inline coherent imaging (ICI) provides in situ, micron-scale depth measurements of laser machining processes at >300 kHz without any requirement for sample transparency or specialized geometry. The imaging beam is delivered coaxially with the laser processing beam facilitating integration into most laser processing platforms. With the ability to image deep (multi-mm) into high aspect features at high acquisition rates, ICI is a promising tool for both process development and online control of laser manufacturing systems.
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