Abstract

This study presents the development of post-processing steps for microfluidics fabricated with selective laser etching (SLE) in fused silica. In a first step, the SLE surface—even inner walls of microfluidic channels—can be smoothed by laser polishing. In addition, two-photon polymerization (2PP) can be used to manufacture polymer microstructures and microcomponents inside the microfluidic channels. The reduction in the surface roughness by laser polishing is a remelting process. While heating the glass surface above softening temperature, laser radiation relocates material thanks to the surface tension. With laser polishing, the RMS roughness of SLE surfaces can be reduced from 12 µm down to 3 nm for spatial wavelength λ < 400 µm. Thanks to the laser polishing, fluidic processes as well as particles in microchannels can be observed with microscopy. A manufactured microfluidic demonstrates that SLE and laser polishing can be combined successfully. By developing two-photon polymerization (2PP) processing in microchannels we aim to enable new applications with sophisticated 3D structures inside the microchannel. With 2PP, lenses with a diameter of 50 µm are processed with a form accuracy rms of 70 nm. In addition, this study demonstrates that 3D structures can be fabricated inside the microchannels manufactured with SLE. Thanks to the combination of SLE, laser polishing and 2PP, research is pioneering new applications for microfluidics made of fused silica.

Highlights

  • The fabrication and functionalization of microfluidic chips has attracted much interest in recent years

  • In this paper we demonstrate the results for the combination of selective laser etching process (SLE), laser polishing and 2.3 Two‐photon polymerization (2PP) for the fabrication of microfluidic devices

  • The SLE parts for testing of laser polishing and 2PP were produced with a LightFab 3D Printer: a CAD model was sliced in layers with a variable distance in the z direction in order to derive the data for the tool path the laser spot has to move along

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Summary

Introduction

The fabrication and functionalization of microfluidic chips has attracted much interest in recent years. The selective laser etching process (SLE) enables microfluidics to be fabricated out of fused silica. SLE makes it possible to machine hollow volumes into transparent materials with a huge freedom of geometry in three dimensions. SLE is a two-step process used for microstructuring of glass materials. Ultrashort pulsed laser radiation is tightly focused into the inside of transparent material. When the intensity exceeds the threshold for nonlinear absorption in the vicinity of the focal point, laser radiation is absorbed and the material becomes locally heated to several thousand degrees Celsius (Hermans et al 2012). Since heated volume is small, extreme cooling rates occur and the material is frozen in the highly excited state. Line-by-line and layer-by-layer, a complete 3D connected grid of lines can be permanently inscribed into the bulk material

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