Abstract
A laser soldering of tape-automated bonding (TAB) leads is tried with a diode-pumped Nd:YAG laser. A 15-W laser diode bar, a multistripe monolithic laser diode array, is used to end-pump Nd:YAG. Twelve beams emitted from 12 stripes, center-to-center spaced 800 mm, of a 1-cm linear diode array were collimated by a lens array of width 1 cm, consisting of 12 gradient-index (GRIN) lenses with 800-mm width, to pump the Nd:YAG facet. The maximum Nd:YAG output power at 1064 nm of 6.3 W is obtained in cw operation. The Nd:YAG laser beam is focused to a spot with a FWHM diameter of 112337 mm. A TAB device with 215-mm-width leads, center-to-center spaced 430 mm, is success- fully soldered by 98-ms irradiation of the laser power of 5.8 W/lead. Soldering is tried with a fiber-coupled Nd:YAG output as well. © 1996 Society of Photo-Optical Instrumentation Engineers.
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