Abstract
Pitch adapters (PAs) are passive electronic components widely used to adapt different pitches between silicon strip detectors and readout electronics. This paper presents an optimized process to fabricate high-density PAs using laser ablation of metal-on-glass layers. Minimum pitch sizes of 40 $\mu \text{m}$ for the pads and 25 $\mu \text{m}$ for the conductive traces were achieved. The resolution of the method allowed the cutting of traces as narrow as 15 $\mu \text{m}$ . Different prototypes and small production series have been successfully manufactured and tested for electrical parameters, bondability, and metrology. Ageing tests were also performed to ensure long-term reliability. The production yield reached 80%. Fully functional particle detectors for high-energy physics have been assembled using these PAs, characterized and tested with lasers and radioactive sources. [2014-0371]
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