Abstract
Currently there are many laser micro fabrication technologies. The technologies are based on the philosophy of either subtractive material from top to down or additive material by bottom up. Laser ablation for instant removes material gradually to produce microstructure. Most common used lasers are ultrafast or UV laser. CO2 or YAG laser also can be found to apply in micro fabrication. Another approach such as micro stereo lithography(uSLA) and selective laser sintering(SLS) adds the materials from bottom to top layer by layer. In this paper the authors introduced a novel technology Laser Vaporizing Sintering(LVS) which combines material removing and adding together: This technology removes the powder material with laser vaporizing and meanwhile sinters the powder material to form micro structure by laser. Several powder particles can be sintered to form a thin wall. It shows great potential advantages to fabricate micro parts.Currently there are many laser micro fabrication technologies. The technologies are based on the philosophy of either subtractive material from top to down or additive material by bottom up. Laser ablation for instant removes material gradually to produce microstructure. Most common used lasers are ultrafast or UV laser. CO2 or YAG laser also can be found to apply in micro fabrication. Another approach such as micro stereo lithography(uSLA) and selective laser sintering(SLS) adds the materials from bottom to top layer by layer. In this paper the authors introduced a novel technology Laser Vaporizing Sintering(LVS) which combines material removing and adding together: This technology removes the powder material with laser vaporizing and meanwhile sinters the powder material to form micro structure by laser. Several powder particles can be sintered to form a thin wall. It shows great potential advantages to fabricate micro parts.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.