Abstract
Transparent brittle materials such as glass and sapphire are widely concerned and applied in consumer electronics, optoelectronic devices, etc. due to their excellent physical and chemical stability and good transparency. Growing re-search attention has been paid to developing novel methods for high-precision and high-quality machining of transparent brittle materials in the past few decades. Among the various techniques, laser machining has been proved to be an effective and flexible way to process all kinds of transparent brittle materials. In this review, a series of laser machining methods, e.g. laser full cutting, laser scribing, laser stealth dicing, laser filament, laser induced backside dry etching (LIBDE), and laser induced backside wet etching (LIBWE) are summarized. Additionally, applications of these techniques in micromachining, drilling and cutting, and patterning are introduced in detail. Current challenges and future prospects in this field are also discussed.
Highlights
Transparent brittle materials are highly important materials in applications to micro/nano-fabrication, microelectronic chips, biochips, biological channels, microfluidics, and optoelectronic devices because of its wide light transmission region, high corrosion resistance, chemical stability, high electrical insulation property, and high temperature and thermal shock resistance
Hard and scratch-resistant sapphire can be applied to 3C products such as LED substrate, protection mirrors of mobile phone camera, and cover glass of smart watches, etc
Laser induced backside wet etching (LIBWE) laser induced backside wet etching (LIBWE) refers to the technique of applying working liquid on the surface of workpiece and focusing the beam on the liquid-solid interface for machining
Summary
Transparent brittle materials are highly important materials in applications to micro/nano-fabrication, microelectronic chips, biochips, biological channels, microfluidics, and optoelectronic devices because of its wide light transmission region, high corrosion resistance, chemical stability, high electrical insulation property, and high temperature and thermal shock resistance. The methods of laser machining transparent brittle materials are introduced, such as laser full cutting, laser scribing, laser stealth dicing, laser filament, LIBDE, and LIBWE. Methods of laser machining transparent brittle materials
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