Abstract
The Kansas City Division of The Bendix Corporation manufactures hybrid microcircuits (HMCs) using both thin film and thick film technologies. Laser machining is used to contour the ceramic substrates and to drill holes in the ceramic for frontside-backside interconnections (vias) and holes for mounting components. A 1000 W CO/sub 2/ type laser is used. The laser machining process, and methods used for removing protruding debris and debris from holes, for cleaning the machined surfaces, and for refiring are described. The laser machining process described consistently produces vias, component holes and contours with acceptable surface quality, hole locations, diameter, flatness and metallization adhesion. There are no cracks indicated by dipping in fluorescent dye penetrant and the substances are resistant to repeated thermal shock.
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