Abstract
AbstractWe report on laser lift‐off (LLO) of AlN/sapphire for UV light‐emitting diodes (LEDs). Underfill between chip and submount is a key factor for the successful LLO of AlN/sapphire. We fabricated thin‐film‐flip‐chip UV LEDs with a peak wavelength of 343 nm using the LLO. Moreover surface texturing was carried out on the exfoliated AlN surface. The light output power from the UV LED after the LLO and the surface texture at exfoliated surface is 1.7 times higher than that before the LLO at 20 mA (© 2012 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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