Abstract
Localized deposition of copper on highly transparent indium-tin oxide (ITO) coated glass substrate cathodes was experimentally explored to produce spot deposits by the combination of focused laser beam bombardment and pulsed potential electroplating. Deposit localization was effected by directing the laser beam on a desired position, while potential pulsing was employed to remove the excess background copper deposit to control the spot size and to maintain high coating quality. © 2002 The Electrochemical Society. All rights reserved.
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