Abstract
The generation of a flexible printed circuit board on polymer fabrics has been a challenge over the last decade. In this work, a copper pattern was obtained on a soft substrate of filter paper/polyacrylonitrile (FP/PAN) film, where the filter paper was commercially available. The pattern of Ag particles was first produced on an Ag+-doped FP/PAN composite film, followed by electroless plating of copper using the metal silver particles as seeds. The in situ reduction of silver particles and the formation of the silver agglomeration pattern were induced by laser irradiation technology on the FP/PAN/AgNO3 composite film. A variety of characterizations indicated that the resultant copper deposition was uniform, with good conductivity properties.
Highlights
The development of high-resolution metal patterns has allowed for significant progress in applications of the microelectronics industry such as surface-mount devices and integrated circuits [1], radio frequency identification and smart cards [2], wireless sensors and temperature sensors (T-sensor) [2,3,4], super hydrophobic surfaces [5], and flexible electronics [6]
The processes of forming silver particles on the surface of filter paper/polyacrylonitrile (FP/PAN) film can be described as follows: when the laser beam is focused on the film surface, the AgNO3 and PAN substrate absorbs the energy of the laser pulse, and a radial temperature area is formed that leads to the decomposition of PAN
The processes of forming silver particles on the surface of FP/PAN film can be described as energy of thewhen laserthe pulse, a radial temperature is formed that3 and leads to the decomposition follows: laserand beam is focused on the filmarea surface, the AgNO
Summary
The development of high-resolution metal patterns has allowed for significant progress in applications of the microelectronics industry such as surface-mount devices and integrated circuits [1], radio frequency identification and smart cards [2], wireless sensors and temperature sensors (T-sensor) [2,3,4], super hydrophobic surfaces [5], and flexible electronics [6]. The technique based on photolithography processes is one of the most used methods to produce metal patterns on hard substrates. Pattern fabrication on soft substrates using this method is hard to process. A new technology based on laser irradiation has been developed to form metal patterns on both hard and soft substrates. We demonstrate a novel method for implanting a deposited metal [15]. Seeding or activation of the dielectric substrate is critical to subsequent composite film for selective electroless copper deposition using laser-induced irradiation on Ag+ -doped successful electroless metal deposition. We demonstrate a novel method for implanting a filter paper/polyacrylonitrile (FP/PAN). Composite film for selective electroless copper deposition using laser-induced irradiation on Ag doped filter paper/polyacrylonitrile (FP/PAN)
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
