Laser‐Induced Polymerization of Photosensitive Resin for Silk Fabric Joining

Abstract

Herein, a new joining method for silk fabrics based on polymerization of polyurethane acrylate (PUA) photosensitive resin induced by a nanosecond 355 nm ultraviolet laser is proposed. After the resin is applied and cured, not only the space between the fiber bundles, but also the gaps within the bundles are filled up with the resin, forming strong interlocking bonds. The infrared spectra of the joint area indicate that there is no textile burning or chemical change on silk fibers. The increase of laser energy density can improve the polymerization degree of the resin and increase the joint strength. However, when the energy density exceeds 1.68 J cm−2, ablation of the photosensitive resin occurs. The amount of filled resin affects the thickness of the joint and its strength. When the resin filling rate is 0.76 mL min−1, the joint has a high filling density and high bearing capacity. The tensile force of the joint reaches 297.10 N, which is higher than the breaking force of the base silk fabric. The tensile force of the joint also increases with the increasing of the joint width. This study provides an alternative process for conventional sawing and stitching in garments fabrication.