Laser-induced backside wet cleaning technique for glass substrates

Abstract

The aim of this paper is to study the laser-induced backside wet cleaning techniques for glass substrates. Two kinds of laser cleaning techniques are proposed in this study. The first involves applying an Nd:YAG laser to the backside of the substrate which is submerged in water. A metal plate is placed below the glass substrate. Most of the laser energy will be absorbed by the metal plate. The metal then vaporizes the water and generates a turbulent bubble flow. The bubble flow removes the alumina particles from the surface of the glass substrate. The second involves using a CO2 laser to generate turbulent bubble flow to remove the particles. Both methods were successfully demonstrated for the removal of submicron particles of 0.5 μm in size. The phenomena of bubble generation and diffusion are presented in the paper. Because the laser is applied to the backside of the substrate, the damage due to the laser heat can be significantly reduced. The quality and efficient of the backside processing is better than those of the front side processing. The proposed techniques have great potential to provide an improved solution for glass cleaning.