Laser impact welding: Investigation on microstructure and mechanical properties of molybdenum-copper welding joint

Abstract

Due to their excellent properties, molybdenum and copper are widely used in the electronics industry. However, the welding of molybdenum and copper is difficult, which limits their application prospects in the field of microelectronics devices. This paper describes a novel method for Mo/Cu welding in micro devices: laser impact welding (LIW). The experimental results found that welding improved with the increase of laser energy. The springback and interface wave in the welding area were observed by optical microscope and scanning electron microscope (SEM)and the results showed that the shapes of the interface wave were flat and zigzag. Energy dispersive spectroscopy (EDS) showed little or no diffusion of elements at the welding interface. Tensile shear test results of the welded specimens showed that there were two kinds of failure forms: solder joint failure and solder joint edge failure. The nano-hardness of the materials in the welding area increased compared with the raw materials.