Laser Glass Frit Sealing for Encapsulation of Vacuum Insulation Glasses

Abstract

Abstract Laser glass frit sealing is a joining method predestined in electronics for the sealing of engineered materials housings in dimensions of some 1 mm2 to several 10 mm2. The application field ranges from encapsulation of display panels to sensor housings. Laser glass frit sealing enables a hermetical closure excluding humidity and gas penetration. But the seam quality is also interesting for other applications requiring a hermetical sealing. One application is the encapsulation of vacuum insulation glass. The gap between two panes must be evacuated for reducing the thermal conductivity. Only an efficient encapsulating technique ensures durable tight joints of two panes for years. Laser glass frit sealing is an alternative joining method even though the material properties of soda lime glass like sensitivity to thermal stresses are much higher as known from engineered materials. An adapted thermal management of the process is necessary to prevent the thermal stresses within the pane to achieve crack free and tight glass frit seams.