Abstract

High-speed laser drilling using low laser power and flexible circuit layout changes was applied to form 3-dimensional circuits in multilayer ceramics to fabricate miniaturized chip inductors and high-frequency power amplifier modules. The optimized combination of pulse YAG laser energy and the laser absorption coefficient of machined materials enabled ultra-fine through-holes to be formed in thin ceramic green sheets without damaging supporting plastic film where ceramic slurry was cast. Drilling basically involved thermal ablation

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