Abstract
Silicon carbide (SiC)-bonded diamond materials, comprising approximately 50% diamond by volume, represent innovative composites with exceptional mechanical and thermal properties, including high hardness, wear and corrosion resistance, and elevated thermal conductivity. Despite these advantageous properties, the machining of these composites presents formidable challenges due to their extremely high hardness. Grinding with diamond tools is commonly employed among the limited viable machining methods. However, the efficiency of this process is hindered by high grinding forces, elevated temperatures, and significantly high tool wear. Additionally, the surface integrity, form, and dimensional accuracy of the workpiece are compromised by the effects of tool wear and high cutting forces. To address these technological constraints in the grinding of SiC-bonded diamond materials, a laser-assisted grinding process has been developed. Ultra-short pulsed laser radiations were effectively utilized to induce material ablation with controlled structural damages, enhancing the productivity and efficiency of the grinding process through reduced grinding forces, temperatures, and tool wear. Furthermore, this study investigated the influence of grinding tools' specifications, design variations, and parameters on key aspects such as grinding forces, surface quality, and tool wear. Substantial reductions of up to 70% in tangential grinding forces, 83% in normal grinding forces, and a modest improvement in surface roughness achieved. The surface integrity analysis revealed a damage-free ground surface when utilizing laser assistance. Furthermore, there was a substantial enhancement in the grinding ratio (G-ratio), achieving an increase of up to 247%, concurrently with a noteworthy improvement in the actual removal depth, reaching up to 99%, when compared to conventional grinding processes. Compared to the utilized segmented metal bonded diamond grinding wheel, the vitrified bonded diamond grinding wheel induced lower grinding forces and higher actual removal rates.
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