Abstract
The selective deposition of metals on dielectric materials is widely used in the electronic industry, making electro-conductive connections between circuit elements. We report a new low-cost laser-assisted method for the selective deposition of copper tracks on polymer surfaces by electroplating. The technique uses a laser for the selective modification of the polymer surface. The electrical conductivity of some polymers could be increased due to laser irradiation. Polyimide samples were treated using nanosecond and picosecond lasers working at a 1064 nm wavelength. An electro-conductive graphene-like layer was formed on the polymer surface after the laser treatment with selected parameters, and the copper layer thickness of 5–20 µm was deposited on the modified surface by electroplating. The selective laser-assisted electroplating technology allows the fabrication of copper tracks on complex shape dielectric materials. The technology could be used in the manufacturing of molded interconnect devices (MID).
Highlights
Recent developments in semiconductor technologies led to the miniaturization of various electronic devices
Laser-induced surface activation (LISA) is a three-step process: firstly, the speci men is laser-treated in distilled water; it is immersed in the palladium solu tion to activate the treated area; and the sample is copper-plated usin2gofa1n4 electro less plating method [3]
The method could be used for the production of copper traces on 3D complex shape materials, where conventional methods, such as photolithography, are not suitable. The disadvantage of this method is that it could be used on certain groups of polymers, of which the surface conductivity could be increased after laser treatment
Summary
Recent developments in semiconductor technologies led to the miniaturization of various electronic devices. LDS is a two-step method, where initially, an electric pattern is written by laser on the surface of the dielectric material. The material is immersed into the electroless copper bath, where copper deposits the laseractivated patterned area [1] The disadvantage of this method is that special materials must be used, doped with inorganic metallic compounds for laser activation. Direct electroplating is a much faster copper deposition method compared with other alternative technologies, based on electroless plating, like LDS [1] and SSAIL [4]. The method could be used for the production of copper traces on 3D complex shape materials, where conventional methods, such as photolithography, are not suitable The disadvantage of this method is that it could be used on certain groups of polymers, of which the surface conductivity could be increased after laser treatment
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