Laser‐Assisted Machining of Damage‐Free Silicon Nitride Parts with Complex Geometric Features via In‐Process Control of Laser Power

Abstract

A methodology to achieve optimal operating conditions for laser‐assisted machining (LAM) is developed for silicon nitride parts with complex geometric features by applying a three‐dimensional, transient thermal model and in‐process laser power control. Complex silicon nitride parts are successfully produced by the LAM operation, where the maximum and material removal temperatures are carefully designed and controlled to achieve good machining results and avoid thermal damage on the final part. On‐line temperature and laser power measurements are conducted and compared with prescribed values to show the effectiveness of the power control scheme. Scanning electron microscopy examination reveals virtually no subsurface microcrack or thermal damage on the silicon nitride parts. The X‐ray diffraction (XRD) study shows the preservation of the silicon nitride microstructure and no phase transformation of β‐Si3N4 during the LAM experiments. XRD residual stress measurements show moderate compressive residual stresses on the silicon nitride workpieces produced by the LAM operation.